Unique Microstructures and High Thermoelectric Performance in n–type Bi<sub>2</sub>Te<sub>2.7</sub>Se<sub>0.3</sub> by the Dual Incorporation of Cu and Y
Publication date: Available online 20 January 2023Source: Materials Today PhysicsAuthor(s): Hyungseok Lee, Taeshik Kim, Seong Chan Son, Jongchan Kim, Dawoon Kim, Jieun Lee, In Chung