Browsed by
Month: June 2024

Damage-free dry transfer method using stress engineering for high-performance flexible two- and three-dimensional electronics

Damage-free dry transfer method using stress engineering for high-performance flexible two- and three-dimensional electronics

Nature Materials, Published online: 21 June 2024; doi:10.1038/s41563-024-01931-yCurrent transfer printing technologies enable versatile flexible devices but challenges remain. Here the authors report a facile, versatile and damage-free…